BGA Ball

ABOUT US

ABOUT ZHONGSHI

Nominated Supplier of China Aerospace and Defence companies

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PRODUCTS

PRODUCTS

All Real Products guide

Oxygen-free copper

Solder Preforms

Solder Paste

Solder Wire

Solder Bar

BGA Ball

Flux/Thinner/Cleaner

High Precision Copper Profiles

Oxygen-free copper

Gold-based Solder Preforms

Reinforced Solder Preforms

Silver-based Solder Preforms

Indium-based Solder Preforms

Lead-free Solder Preforms

Tin-lead Solder Preforms

Flux-Coated Preforms

Lead-free Solder paste

Halogen-free Solder paste

Tin Lead Solder paste

Low Silver High Reliability solder paste

High Strength Solder paste

Jetting Solder Paste

Solder Pastes for Laser Soldering

Micron Solder Powder

Lead-free Tin wire

Tin Lead tin wire

Tin Bar

BGA Ball

Flux

Thinner

Cleaner

Copper Fluted Wire
APPLICATION

APPLICATION

Provide Customized Solutions and services

Application
RESEARCH

SCIENTIFIC RESEARCH

Science & Technology Progress rapidly,And New products are constantly changing

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SERVICE SUPPORT

Deep Cultivation of High-end solder industry head enterprise for more than 20 years

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ABOUT US
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CONTACT US

Application

Oxygen-free copper

Solder Preforms

Flux/Thinner/Cleaner

High Precision Copper Profiles

BGA Ball

This product is suitable for BGA, CSP, MCM and other IC packaging, but also used in other micro-welding.

PRODUCT SELECTION

Pb-free

Tin-lead

Product Specification Parameter