Solder Paste
SOLDER PASTE
Jetting Solder Paste-ZSPD03-DJ19

High reliability, low voidage; Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc.

Product Characteristics

ZSRH01-N can completely solve the problem of oxidizing part electrodes placed for a long time, solder pads with poor condition of tinspray plates, Ni materials that are difficult to weld, QFN/Au plating modules with tin climbing problems, etc.

 

Specification

METAL COMPOSITION PARTICLE FLUX CONTENT

SAC305

SAC105

SAC0307

Type3(25~45um) 11.5±0.5%
Type4(20~38um) 11.7±0.5%
Type5(15~32um) 11.8±0.5%

 

Product Characteristics

ITEM

CHARACTERISTIC VALUE

TEST METHOD

Halide Content(%) 0.20±0.05 JIS Z 3197-8.1.4.2.1
Copper Plate corrosion Unoccurred JIS Z 3284-4
Aqueous Impedance(Ω・cm) >1×104 JIS Z 3197-8.1.1

Insulation Impedance

(Ω)  

40℃/90%RH >1×1011 JIS Z 3284-3
85℃/85%RH >1×108
Migration Test No migration JIS Z 3284-14
Diffusivity(%) > 75 JIS Z 3197-8.3.1.1
Viscosity(Pa・s) 180±30 JIS Z 3284-6
Tin Shot Lv.1~3 JIS Z 3284-11
Printability M3 JIS Z 3284-5
Printing Collapse 0.3mm below JIS Z 3284-7
Heating Collapse 0.3mm below JIS Z 3284-8

 

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